Abstract: Thermal performance of a three chip, overmolded wire-bonded plastic ball grid array (WB-PBGA) package with four layer substrate attached to a 1.52-mm-thick, four-layer (2s2p), FR4 printed wiring ...

Abstract: Enhancements to thermal performance of FC-PBGA packages due to underfill thermal conductivity, controlled collapse chip connection (C4) pitch, package to printed wiring board (PWB) interconnection ...

Abstract: In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board ...

Abstract: A previous study by the authors on fin-shape optimization of a plate fin heat sink has concluded that a depopulated central zone, just under the center of the fan, provides a better thermal ...

Abstract: The thermal evolution of liquid and solid during the radially inward solidification of spherical balls of liquid has been studied by accounting for the increase in the density as phase transition ...

Abstract: In multi-layer printed wiring boards (PWBs), electrical connections between different layers are accomplished with plated through holes (PTHs). The reliability of the PTH barrel and the PTH-inner ...

Abstract: Since its inception 20 years ago, ITherm, The Intersociety Conference on Thermal, Mechanical, and Thermomechanical Phenomena in Electronic Systems, has been addressing recent advances in the area ...

Abstract: Thermal dispersion due to local flows is significant in heat transfer with forced convection in porous media. The effects of parametrized melting (M), thermal dispersion (D), inertia (F), and ...