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RISMulti-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip-chip bonding is a kind of chip packaging technology, which can make fabricated chips lighter and smaller. Thermo-ultrasonic flip-chip bonding is a technology that directly joins gold pad ...