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RISInviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Both localized power densities and overall power consumption within the data center continue to rise, following the same upward trend as the information technology (IT) equipment stored within the data center. Air cooling ...
Comparison of the Volume of Fluid and CLSVOF Methods for the Assessment of Flow Boiling in Silicon Microgaps
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The three-dimensional (3D) stacking of integrated circuits (ICs), and emergent microelectronic technologies require low-profile cooling solutions for the removal of relatively high heat fluxes. The flow boiling of dielectric ...
Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through ...
Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review focuses on progress and emerging challenges in experimentally validated modeling of microscale urban thermal environments over the last two decades. In the last few decades, there has been a surge in urban ...
Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through ...
Predictive Model Development and Validation for Raised Floor Plenum Data Center
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the explosion in digital traffic, the number of data centers as well as demands on each data center, continue to increase. Concomitantly, the cost (and environmental impact) of energy expended in the thermal management ...
Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Metal foams have been often used for thermal management due to their favorable characteristics including high specific surface area (SSA), high thermal conductivity, and low relative density. However, they are accompanied ...
Recent Progress and Challenges in Microscale Urban Heat Modeling and Measurement for Urban Engineering Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review focuses on progress and emerging challenges in experimentally validated modeling of microscale urban thermal environments over the last two decades. In the last few decades, there has been a surge in urban ...
Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Structural flexibility has become a common feature in emerging microsystems with increasing heat fluxes. The thermal control of such applications is a significant challenge because of both structural and volumetric ...
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High porosity metal foams offer large surface area per unit volume and have been considered as effective candidates for convection heat transfer enhancement, with applications as heat sinks in electronics cooling. In this ...