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Microstructural Characterization of Chip Segmentation Under Different Machining Environments in Orthogonal Machining of Ti6Al4V
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Segmented chips are known to form in machining of titanium alloys due to localization of heat in the shear zone, which is a function of machining environment. To investigate the correlation between machining environments ...
Analytical Modeling of Chip Geometry in High Speed Ball End Milling on Inclined Inconel 718 Workpieces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Most often contoured surfaces inclined at several inclinations are generated using ballend milling of aerospace and automobile components. It is understood that the chip morphology and the corresponding cutting mechanisms ...
Analysis of Electrolytic Flow Effects in Micro Electrochemical Grinding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electrochemical grinding (ECG) at macrolevel and microlevel finds increasing use in medical device manufacturing industry. To enhance application of microECG, a comprehensive study of the role electrolyte flow in the ...
Monitoring ShearingPlowing Transitions in MicroMilling Using Fluctuations in Cutting Forces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In micromilling, understanding transitions between the desired shearingdominant to the undesired plowingdominant cutting mechanism could help obtain high quality microfeatures. This work investigates the transitions in ...
Ply-Blocking Phenomenon and Hole Size Effects in Modeling Progressive Damage in Fiber-Reinforced Plastics Laminates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work presents a 3D progressive damage model based on Puck’s failure theory and linear damage evolution in fiber-reinforced plastic (FRP) laminates. It includes shear nonlinearity, in situ strengths, equivalent ...
Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Slicing of Si wafers through abrasive processes generates various surface defects on wafers such as cracks and surface contaminations. Also, the processes cause a significant material loss during slicing and subsequent ...
Transient Analysis of Laser Ablation Process With Plasma Shielding: One Dimensional Model Using Finite Volume Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a comprehensive transient model of various phenomena that occur during laser ablation of TiC target at subnanosecond timesteps. The model is a 1D numerical simulation using finite volume method (FVM) ...
Fracture Energy Evaluation Using J Integral in Orthogonal Microcutting
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fracture in cutting of ductile as well as brittle materials can be characterized using parameters such as K, G, R, and Jintegral; of these, R has been widely used. To accurately evaluate the contribution of fracture energy ...
High Strain Rate and High Temperature Behavior of Ti–6Al–4V Alloy Under Compressive Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The titanium alloy (grade 5) is a two-phase material, which finds significant applications in aerospace, medical, marine fields, owing to its superior characteristics like high strength-to-weight ratio, excellent corrosion ...
Numerical Simulation and Experimentation on Electrochemical Buffing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electrochemical buffing (ECB) process primarily works on the principle of preferential dissolution by coupling of electrical, chemical, and mechanical actions. ECB is used to buff clean and hygienic nanoscale surface ...