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    The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001:;page 106
    Author(s): Thomas D. Moore; John L. Jarvis
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new ...
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