YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-10 of 13

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003:;page 31009
    Author(s): Jin Yang; I. Charles Ume
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound ...
    Request PDF

    Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 001:;page 11013
    Author(s): Jin Yang; I. Charles Ume
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip ...
    Request PDF

    Application of Suspension Bridges Stiffened by Prestressed Concrete Slabs in China 

    Source: Journal of Bridge Engineering:;2007:;Volume ( 012 ):;issue: 002
    Author(s): Gongyi Hsu; Sili Shu; Jin Yang
    Publisher: American Society of Civil Engineers
    Abstract: Four suspension bridges stiffened by prestressed concrete slabs were designed and constructed on highways in southwestern mountainous areas of China. These bridges are the first applications of its kind in China. This paper ...
    Request PDF

    Research on the Mechanism of Cathode Failure of LeadAcid Battery Under Extreme Conditions 

    Source: Journal of Electrochemical Energy Conversion and Storage:;2022:;volume( 020 ):;issue: 004:;page 41002
    Author(s): Li, Yaowei;Lyu, Nawei;Jin, Yang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Leadacid batteries have the advantages of wide temperature adaptability, large discharge power, and high safety factor. It is still widely used in electrochemical energy storage systems. In order to ensure the application ...
    Request PDF

    Research on the Mechanism of Cathode Failure of Lead-Acid Battery Under Extreme Conditions 

    Source: Journal of Electrochemical Energy Conversion and Storage:;2022:;volume( 020 ):;issue: 004:;page 41002-1
    Author(s): Li, Yaowei; Lyu, Nawei; Jin, Yang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Lead-acid batteries have the advantages of wide temperature adaptability, large discharge power, and high safety factor. It is still widely used in electrochemical energy storage systems. In order to ensure the application ...
    Request PDF

    Factors Determining the Asymmetry of ENSO 

    Source: Journal of Climate:;2017:;volume( 030 ):;issue: 016:;page 6097
    Author(s): Liang, Jin;Yang, Xiu-Qun;Sun, De-Zheng
    Publisher: American Meteorological Society
    Abstract: AbstractA fundamental aspect of the observed ENSO is the positive asymmetry between its two phases: the strongest El Niño is stronger than the strongest La Niña. The nonlinear term in the equation for the surface ocean ...
    Request PDF

    Elastic Analysis for Defects in an Orthotropic Kirchhoff Plate 

    Source: Journal of Applied Mechanics:;2007:;volume( 074 ):;issue: 003:;page 438
    Author(s): Kyeong-Jin Yang; Ki-Young Lee; Jong-Hwa Chang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Defects such as inhomogeneities, inclusions with eigenstrains, and dislocations in an infinite orthotropic Kirchhoff plate are analyzed. These results could be applied to thin plate problems ...
    Request PDF

    Using Novel Complex-Efficient FastICA Blind Deconvolution Method for Urban Water Pipe Leak Localization in the Presence of Branch Noise 

    Source: Journal of Water Resources Planning and Management:;2021:;Volume ( 147 ):;issue: 010:;page 04021072-1
    Author(s): Mingyang Liu; Jin Yang; Wei Zheng; Endong Fan
    Publisher: ASCE
    Abstract: Leaks in water pipelines can create many problems, such as financial loss, environmental pollution, and public health hazards. Previous scholars and engineers have researched leak detection and localization methods for ...
    Request PDF

    Sodium Oleate and Styrene-Acrylate Copolymer Emulsion-Modified Cement Mortar: Functional Combination of Physical Barrier and Hydrophobicity 

    Source: Journal of Materials in Civil Engineering:;2023:;Volume ( 035 ):;issue: 008:;page 04023242-1
    Author(s): Jin Yang; Jinfu Wang; Xingyang He; Xiaolei Yu; Ying Su; Jianxiang Huang; Sang-Keun Oh
    Publisher: ASCE
    Abstract: Styrene-acrylic emulsion (SAE)-modified mortar is typically used as an impermeable cement-based material. Although high-volume SAE-modified mortar shows excellent penetration resistance performance, this property can also ...
    Request PDF

    Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 002:;page 21006
    Author(s): Jin Yang; Camil Ghiu; George White; Lizheng Zhang; I. Charles Ume
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Microelectronics packaging technology has evolved from through-hole, and bulk configuration to surface-mount, and small-profile ones. Today’s electronics industry is also transiting from SnPb to ...
    Request PDF
    • 1
    • 2
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    ... View More

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian