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RISQuantification of Thermal Resistance of Transient Liquid Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu Based Microchannel Heat Exchangers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Transient liquid phase (TLP) bonding of Cu structures with a thin elemental Al intermediate bonding layer is being used to assemble Cubased, enclosed, microchannel heat exchangers (MHEs). The heterogeneous Cu/Al/Cu TLP ...