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    Thermal Spreading/Constriction From an Isothermal Source Into a Multilayer Orthotropic Semi-Infinite Flux Tube 

    Source: ASME Journal of Heat and Mass Transfer:;2024:;volume( 146 ):;issue: 006:;page 61401-1
    Author(s): Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal spreading and constriction have been widely studied due to relevance in heat transfer across interfaces with imperfect contact and problems such as microelectronics thermal management. Much of the past work in this ...
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    Surrogate Modeling-Based Analysis of Concentration Decay in Diffusion-Reaction Mass Transfer Problems 

    Source: ASME Journal of Heat and Mass Transfer:;2025:;volume( 147 ):;issue: 006:;page 63201-1
    Author(s): Abbas, Muhammad Mehdi; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Diffusion-reaction phenomena occur commonly in heat and mass transfer problems. Determining the decay characteristics of such problems by solving the underlying energy/mass conservation equation is often mathematically ...
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    Solution of the Phase Change Stefan Problem With Time-Dependent Heat Flux Using Perturbation Method 

    Source: Journal of Heat Transfer:;2019:;volume( 141 ):;issue: 002:;page 24503
    Author(s): Parhizi, Mohammad; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Theoretical understanding of phase change heat transfer problems is of much interest for multiple engineering applications. Exact solutions for phase change heat transfer problems are often not available, and approximate ...
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    Analytical Solution for Temperature Distribution in a Multilayer Body With Spatially Varying Convective Heat Transfer Boundary Conditions on Both Ends 

    Source: Journal of Heat Transfer:;2020:;volume( 143 ):;issue: 003:;page 034501-1
    Author(s): Zhou, Long; Parhizi, Mohammad; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Analytical modeling of thermal conduction in a multilayer body is of practical importance in several engineering applications such as microelectronics cooling, building insulation, and micro-electromechanical systems. A ...
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    Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging 

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 002:;page 020901-1
    Author(s): Salvi, Swapnil S.; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Rapid detection of hardware Trojans on a semiconductor chip that may run malicious processes on the chip is a critical and ongoing security need. Several approaches have been investigated in the past for hardware Trojan ...
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    Numerical Study of a Non-Linear Porous Sublimation Problem With Temperature-Dependent Thermal Conductivity and Concentration-Dependent Mass Diffusivity 

    Source: ASME Journal of Heat and Mass Transfer:;2023:;volume( 145 ):;issue: 007:;page 72701-1
    Author(s): Chaurasiya, Vikas; Jain, Ankur; Singh, Jitendra
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Sublimation heat transfer occurs in a wide range of engineering processes, such as accelerated freeze drying (AFD), energy storage, and food technology. Particularly in the microwave AFD process, preservation of material ...
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    Thermal Modeling of Ultraviolet Nanoimprint Lithography 

    Source: Journal of Manufacturing Science and Engineering:;2013:;volume( 135 ):;issue: 006:;page 64501
    Author(s): Patel, Bhavik C.; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Nanoimprint lithography (NIL) is a promising nanomanufacturing technology that offers an alternative to traditional photolithography for manufacturing nextgeneration semiconductor devices. This technology involves coating ...
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    Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits 

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 002:;page 20908
    Author(s): Choobineh, Leila; Jones, Jared; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Three-dimensional integrated circuits (3D ICs) attract much interest due to several advantages over traditional microelectronics design, such as electrical performance improvement and reducing interconnect delay. While the ...
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    Measurement Sensitivity Analysis of the Transient Hot Source Technique Applied to Flat and Cylindrical Samples 

    Source: Journal of Thermal Science and Engineering Applications:;2017:;volume( 009 ):;issue: 001:;page 11002
    Author(s): Ostanek, Jason; Shah, Krishna; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The transient source measurement technique is a nonintrusive, nondestructive method of measuring the thermal properties of a given sample. The transient source technique has been implemented using a wide variety of sensor ...
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    Measurement of Multiscale Thermal Transport Phenomena in Li-Ion Cells: A Review 

    Source: Journal of Electrochemical Energy Conversion and Storage:;2016:;volume( 013 ):;issue: 003:;page 30801
    Author(s): Shah, Krishna; Vishwakarma, Vivek; Jain, Ankur
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The performance, safety, and reliability of electrochemical energy storage and conversion systems based on Li-ion cells depend critically on the nature of heat transfer in Li-ion cells, which occurs over multiple length ...
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