Abstract: In this study, both two-dimensional and three-dimensional finite element analyses were used to study the stress distribution in and deflection of the flip chip assembly under thermal loading. ...

Abstract: This paper focuses on aspects of fracture mechanics of interface cracks in anisotropic bimaterials. In this case there is a coupling of all three crack-tip fracture modes in the natural ...

Abstract: A self-consistent scheme is used to describe the behavior of nanocrystalline F.C.C. materials. The material is approximated as a composite with two phases. The inclusion phase represents the ...

Abstract: This paper focuses on mechanical testing designed to determine the static failure envelope for a conductive adhesive. Samples were made by bonding copper pegs together with the conductive adhesive. ...