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    Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004:;page 378
    Author(s): J. M. Pitarresi; A. A. Primavera
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The estimation of the mechanical reliability of components on a vibrating circuit card continues to be an important part of the overall reliability assessment for electronic packages. To achieve ...
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    A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001:;page 118
    Author(s): J. M. Pitarresi; A. V. Di Edwardo
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper approaches the problem of improving an initial guess at support locations for a vibrating circuit card so as to increase the first natural frequency of the card. The finite element ...
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    A Simple Technique for the Rapid Estimation of the Optimal Support Locations for a Vibrating Plate 

    Source: Journal of Vibration and Acoustics:;1992:;volume( 114 ):;issue: 001:;page 112
    Author(s): J. M. Pitarresi; R. J. Kunz
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper is aimed at presenting a simple technique for the rapid estimation of the optimal point support locations of vibrating plates. Using a two-dimensional nonlinear least-squares fit of ...
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    An Air Layer Modeling Approach for Air and Air/Vacuum Bearings 

    Source: Journal of Manufacturing Science and Engineering:;1997:;volume( 119 ):;issue: 003:;page 388
    Author(s): J. M. Pitarresi; K. A. Haller
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Air layer supported bearing pads, or “air bearings” as they are commonly called, are popular because of their high load capacity and low in-plane coefficient of friction, making them well ...
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    Solder Joint Reliability Prediction by the Integrated Matrix Creep Method 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 002:;page 55
    Author(s): R. J. Iannuzzelli; J. M. Pitarresi; V. Prakash
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load ...
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    Optimal Design Procedures for Active Structures 

    Source: Journal of Structural Engineering:;1988:;Volume ( 114 ):;issue: 012
    Author(s): J. Z. Cha; J. M. Pitarresi; T. T. Soong
    Publisher: American Society of Civil Engineers
    Abstract: The problem of optimal design of active structures has been shown to be one of simultaneous structural and control design optimization. The basic equations represent, in general, a large system of coupled nonlinear ...
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    The “Smeared” Property Technique for the FE Vibration Analysis of Printed Circuit Cards 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 003:;page 250
    Author(s): J. M. Pitarresi; D. V. Caletka; R. Caldwell; D. E. Smith
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The primary objective of this paper is to investigate the accuracy of the finite element (FE) smeared properties approach for the determination of the mode shapes and frequencies of a printed ...
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    Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 441
    Author(s): S. Chaparala; M. Meilunas; J. M. Pitarresi; S. Parupalli; S. Mandepudi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). ...
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