Abstract: An analytical model is developed for predicting the time-dependent shearing displacement in area-array solder interconnects due to global CTE mismatch under thermal cycling. As a first step toward ...

Abstract: Fundamental study of deformation and fatigue fracture behavior of solder alloys under complex load conditions is a key to enabling implementation of sophisticated three-dimensional (3D) time-dependent ...

Abstract: In this paper, intergranular

Abstract: To simulate brittle rocks, a mixture of sand, plaster of paris, and water was used as a model material. Thin galvanized sheets were used to create joints in blocks made out of the model material. To investigate the failure ...