Abstract: Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and ...

Abstract: The main purpose of this work is to discuss the ability of finite element analyses, together with an appropriate anisotropic fracture criterion, to predict the ultimate load and type of fracture ...

Abstract: The stiffness of the external fixation highly influences the fracture healing pattern. In this work we study this aspect by means of a finite element model of a simple transverse mid-diaphyseal ...

Abstract: Bridge rehabilitation utilizing a hybrid fiber-reinforced polymeric composite has recently been completed in Blacksburg, Va. This project involved replacing the superstructure in the Tom's Creek Bridge, a rural short-span ...