Abstract: The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, ...

Abstract: In this paper, an “interfacial boundary volume” based damage criterion was proposed in combination with the modified Coffin-Manson model to predict solder fatigue. This criterion assumes that ...

Abstract: The effect of underfill material on reliability of flip chip on board (FCOB) assemblies is investigated in this study by using two-dimensional and three-dimensional finite element simulations ...