Abstract: In the past several years there have been a number of papers published which provide closed-form solutions for the stresses in bonded layers of materials. These closed-form solutions offer a ...

Abstract: A finite element analysis has been conducted to provide a new explanation for PLCC cracking during soldering and develop a working model for the cracking phenomena. The model shows that cracking ...

Abstract: Industy is concerned with reliability questions for surface mounted Plastic Encapsulated Chip Carrier (PLCC) devices and various aspects of the encapsulation and mounting process have been studied ...