Abstract: For nearly 20 years, the Wind Turbine Materials and Constructions (WMC) group at Delft University of Technology has been carrying out research on the materials, components and structures for ...

Abstract: Pavement temperature profile data can be quite useful in the analysis of stresses in jointed concrete pavements produced by temperature gradients within the slabs. Many stress analysis procedures consider the temperature ...

Abstract: The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize ...

Abstract: This paper investigates the effect of the anisotropic behavior of the die and the time- and temperature-dependent behavior of epoxy molding compound on the packaging induced stresses for a quad ...

Abstract: Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is ...