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    Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations 

    Source: Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004:;page 41002
    Author(s): Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Boiling water in small channels that are formed along turbine blades has been examined since the 1970s as a means to dissipating large amounts of heat. Later, similar geometries could be found ...
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    Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003:;page 31008
    Author(s): Jaeseon Lee; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study examines the pressure drop characteristics of subcooled two-phase microchannel heat sinks. A new model is proposed, which depicts the subcooled flow as consisting of a homogeneous ...
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    A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004:;page 381
    Author(s): Weilin Qu; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study provides a comprehensive methodology for optimizing the design of a two-phase micro-channel heat sink. The heat sink parameters are grouped into geometrical parameters, operating ...
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    Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 001:;page 30
    Author(s): Jaeseon Lee; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device ...
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    A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 452
    Author(s): Milan Visaria; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study provides a new systematic approach to predicting the effects of spray inclination on critical heat flux (CHF). Experiments were performed with three pressure spray nozzles over a ...
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    Pumpless Loop for Narrow Channel and Micro-Channel Boiling 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003:;page 431
    Author(s): Swaraj Mukherjee; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A compact cooling system is examined which capitalizes upon fluid density differences between two vertical, parallel, interconnected tubes to achieve a pumpless cooling loop. A heat-dissipating ...
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    Enhanced Design of Cross-Flow Microchannel Heat Exchanger Module for High-Performance Aircraft Gas Turbine Engines 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 006:;page 61801
    Author(s): Brittany Northcutt; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study explores the design of highly compact air–fuel heat exchangers for high-performance aircraft turbine engines. The heat exchangers consist of a large number of modules that can be ...
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    Sensible Heating and Boiling Incipience in Free-Falling Dielectric Liquid Films 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 001:;page 46
    Author(s): William J. Marsh; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Controlling boiling incipience is of paramount importance for reliable operation of liquid-cooled microelectronic heat sources during power transients. This study focuses on heat transfer from a ...
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    Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004:;page 290
    Author(s): Morris B. Bowers; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Mini-channel (D = 2.54 mm) and micro-channel (D = 510 μm) heat sinks with a 1-cm2 heated surface were tested for their high heat flux performance with flow boiling of R-113. Experimental ...
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    Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004:;page 323
    Author(s): Kurt A. Estes; Issam Mudawar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The performances of free jets and sprays were compared experimentally in cooling a 12.7 × 12.7 mm2 chip in order to ascertain the effects of key parameters on cooling performance and to ...
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