Abstract: Rapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a ...

Abstract: Power densification and rising module heat losses cannot be managed by traditional “external-to-case” cooling solutions. This is especially pronounced in high voltage systems, where intervening layers of insulating material ...

Abstract: Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and ...