Abstract: In this part the heat, mass, and momentum transfer within a curing over that is commonly used in microelectronic manufacturing have been numerically analyzed. The local partial pressure of the ...

Abstract: We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding ...

Abstract: During normal power cycling of the electronic equipment, the differing coefficients of thermal expansion result in differential elongations. Because each level of packaging is subject to mounting ...

Abstract: A curing oven that is commonly used in microelectronic manufacturing has been analyzed to determine the causes of contamination of parts passing through the oven, and to eliminate this ...

Abstract: The thermal evolution of liquid and solid during the radially inward solidification of spherical balls of liquid has been studied by accounting for the increase in the density as phase transition ...

Abstract: Ball formation is the first step in wire bonding of semiconductor chips to their lead frames. An electric discharge melts the wire and surface tension causes the melt to roll up into a ball; ...