YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-3 of 3

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Punching Shear Strength of Simply Supported Ferrocement Slabs 

    Source: Journal of Materials in Civil Engineering:;2001:;Volume ( 013 ):;issue: 006
    Author(s): M. A. Mansur; I. Ahmad; P. Paramasivam
    Publisher: American Society of Civil Engineers
    Abstract: The results of punching shear tests on 31 square ferrocement slabs are reported in this paper. The slabs were simply supported on all four sides and tested under a central concentrated load. The parameters investigated ...
    Request PDF

    The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 003:;page 246
    Author(s): M. K. Md Arshad; I. Ahmad; A. Jalar; G. Omar; U. Hashim
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper reports the effects of a multiple zincation process on the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the ...
    Request PDF

    Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 302
    Author(s): Patricia F. Mead; Z. Fathi; I. Ahmad; Aravind Ramamoorthy; Shapna Pal
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    ... View More

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian