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    Reliable Ceramic Window Design for Electronic Devices 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 349
    Author(s): Hsien-Yang Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effective operations of a high voltage vacuum electronic device, such as a traveling wave tube, depends on its ability to maintain high vacuum environments. However, during temperature tests, ...
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    Fluid Flow Modeling and Simulation for the Coaxial Cable of the LEASAT Antenna System 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 358
    Author(s): Hsien-Yang Yeh; Hen-Geul Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A preliminary fluid flow modeling, analysis, and simulation of the gas pressure profile within a 259 cm long coaxial cable is presented. This coaxial cable is part of the antenna system of ...
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    Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002:;page 185
    Author(s): J. Cepeda-Rizo; Hsien-Yang Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition ...
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    Numerical Simulations of Longitudinal Elastic Behavior of Single-Walled Carbon Nanotubes–Reinforced Polymer Nanocomposites 

    Source: Journal of Nanomechanics and Micromechanics:;2014:;Volume ( 004 ):;issue: 002
    Author(s): James Han; Yu-Fu Ko; Hsien-Yang Yeh
    Publisher: American Society of Civil Engineers
    Abstract: The longitudinal elastic behavior of single-walled carbon nanotubes (SWCNTs) and SWCNT reinforced polymer nanocomposites are investigated. Finite-element (FE) models of SWCNTs and SWCNT reinforced polymer nanocomposites ...
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    Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002:;page 178
    Author(s): J. Cepeda-Rizo; N. Teneketges; Hsien-Yang Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The paper presents a study on printed wiring board (PWB) warpage caused by the mechanical fastening of separable interconnects, known as land grid array (LGA) package assemblies. Out-of-plane ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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