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    In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003:;page 31003
    Author(s): Ben-Je Lwo; Jeng-Shian Su; Hsien Chung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with ...
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    Joint Self-Tuning With Cartesian Setpoints 

    Source: Journal of Dynamic Systems, Measurement, and Control:;1986:;volume( 108 ):;issue: 002:;page 146
    Author(s): P. G. Backes; G. G. Leininger; Chun-Hsien Chung
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A joint coordinate self-tuning manipulator control method is presented which uses Cartesian setpoints. The method is capable of both position and hybrid control. Position and force errors are ...
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    Parameter Calibrations on MOSFET Stress Sensors 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003:;page 31004
    Author(s): Ren-Tzung Tan; Kun-Fu Tseng; Hsien Chung; Ben-Je Lwo; Chun-Pai Tang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to the carrier mobility changes with the mechanical loading and its small size, the MOSFET (metal-oxide-semiconductor field-effective-transistor) has the potential to be a suitable chip stress ...
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