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In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Piezoresistive sensors have been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, test chips with ...
Joint Self-Tuning With Cartesian Setpoints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A joint coordinate self-tuning manipulator control method is presented which uses Cartesian setpoints. The method is capable of both position and hybrid control. Position and force errors are ...
Parameter Calibrations on MOSFET Stress Sensors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Due to the carrier mobility changes with the mechanical loading and its small size, the MOSFET (metal-oxide-semiconductor field-effective-transistor) has the potential to be a suitable chip stress ...
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