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Transient Three-Dimensional Thermal Simulation of a Fin Field-Effect Transistor With Electron–Phonon Heat Generation, Three Phonon Scattering, and Drift With Periodic Switching
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The International Roadmap for Devices and Systems shows Fin field-effect transistor (FET) array transistors as the mainstream structure for logic devices. Traditional methods of Fourier heat transfer analysis that are ...
Flow Rate and Wall Shear Stress Characterization of a Biomimetic Aerosol Exposure System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Current in vitro emissions and exposure systems lack biomimicry, use unrealistic flow conditions, produce unrealistic dose, and provide inaccurate biomechanical cues to cell cultures, limiting ability to correlate in vitro ...