Abstract: Hygroscopic and thermal expansion behavior of advanced polymers is investigated when subjected to combined high temperature and moisture conditions. An enhanced experimental–numerical hybrid procedure is proposed to ...

Abstract: Reliability issues associated with moisture have become increasingly important as advanced electronic devices are nowhere more evident than in portable electronic products. The transition to the Pb-free solders, which ...

Abstract: A blister testing procedure combined with a numerical procedure can be used effectively for characterizing the adhesion strength. A challenge arises when it is implemented after subjecting samples to various environmental ...

Abstract: Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented ...