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RISEffects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The behavior of leadfree solder alloys under realistic service conditions is still not well understood. Life prediction of solder joints relies on conducting accelerated tests and extrapolating results to service conditions. ...
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joints in electronic assemblies are subjected to mechanical and thermal cycling. These cyclic loadings lead to the fatigue failure of solder joints involving damage accumulation, crack initiation, crack propagation, ...
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of ...
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low-temperature solder (LTS) alloys have recently ...
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods ...