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RISMinimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The semiconductor packaging technologies have seen its growth from multichip module (MCM), system in package (SiP), system on chip (SoC) to the heterogeneous integration of the MCM. Thermal management of multichip vertically ...
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling ...
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ...
Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of ...