Abstract: An air cooling scheme is proposed for 3-D packaging. It consists of converging, impinging, and diverging flows among stacked circuit packs. Its cooling concept is demonstrated by experimental ...

Abstract: Flip-Chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. To assist their technology advancements, ...

Abstract: This paper investigates the steady-state responses of a rotor system supported by auxiliary bearings in which there is a clearance between the rotor and the inner race of the bearing. A ...