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    Interfacial Thermal Stresses in Trilayer Assemblies 

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003:;page 314
    Author(s): H. R. Ghorbani; J. K. Spelt
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are ...
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    DSpace software copyright © 2002-2015  DuraSpace
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