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RISEvaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moiré Interferometry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental investigation dealing with failure characterization of 63/37 solder-copper interfaces is presented. The method of moiré interferometry is used for mapping elasto-plastic deformations ...