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RISTime- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding ...
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is ...