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    Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation 

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002:;page 20903
    Author(s): Greve, Hannes; Ali Moeini, S.; McCluskey, Patrick; Joshi, Shailesh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Transient liquid phase sintering (TLPS) is a novel high-temperature attach technology. It is of particular interest for application as die attach in power electronic systems because of its high-melting temperature and high ...
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