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RISA Comparative Study of Thermal Metrology Techniques for Ultraviolet Light Emitting Diodes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Methods used to measure the temperature of AlxGa1−xN based ultraviolet light emitting diodes (UV LEDs) are based on optical or electrical phenomena that are sensitive to either local, surface, or average temperatures ...
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasing demand for tightly integrated gallium nitride high electron mobility transistors (HEMT) into electronics systems requires accurate thermal evaluation. While these devices exhibit favorable electrical ...
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ...
Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates ...
Mechanical Behavior of Carbon Nanotube Forests Grown With Plasma Enhanced Chemical Vapor Deposition: Pristine and Conformally Coated
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plasma-enhanced chemical vapor deposition (PECVD) is a well-known method for the synthesis of carbon nanotube (CNT) forests with the electric field in the plasma sheath being responsible for the vertical orientation of ...