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    Modeling of Ball-End Milling Forces With Cutter Axis Inclination 

    Source: Journal of Manufacturing Science and Engineering:;2000:;volume( 122 ):;issue: 001:;page 3
    Author(s): Ismail Lazoglu; Graduate Assistant; Steven Y. Liang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the machining of sculpture surfaces with ball-end mill, the cutter axis or workpiece is often inclined to generate an admissible orientation. This paper primarily presents an enhanced cutting ...
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    A Numerical Scheme for Dynamic Systems Containing Fractional Derivatives 

    Source: Journal of Vibration and Acoustics:;2002:;volume( 124 ):;issue: 002:;page 321
    Author(s): Lixia Yuan; Graduate Assistant; Om P. Agrawal
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a numerical scheme for dynamic analysis of mechanical systems subjected to damping forces that are proportional to fractional derivatives of displacements. These equations ...
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    An Approach to Decision-Based Design With Discrete Choice Analysis for Demand Modeling 

    Source: Journal of Mechanical Design:;2003:;volume( 125 ):;issue: 003:;page 490
    Author(s): Henk Jan Wassenaar; Graduate Assistant; Wei Chen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, we present the importance of using a single criterion approach to Decision-Based Design (DBD) by examining the limitations of multicriteria approaches. We propose in this paper ...
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    Parametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003:;page 234
    Author(s): Y. T. Lin; Graduate Assistant; C. T. Peng; Graduate Assistant; K. N. Chiang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The demands for electronic packages with lower profile, lighter weight, and higher input/output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level ...
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    Tip Clearance Effects in a Turbine Rotor: Part I—Pressure Field and Loss 

    Source: Journal of Turbomachinery:;2001:;volume( 123 ):;issue: 002:;page 296
    Author(s): Xinwen Xiao; Graduate Assistant; Andrew A. McCarter; Graduate Assistant; Budugur Lakshminarayana; Evan Pugh Professor and Director
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents an experimental investigation of the effects of the tip clearance flow in an axial turbine rotor. The effects investigated include the distribution and the development of ...
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    Tip Clearance Effects in a Turbine Rotor: Part II—Velocity Field and Flow Physics 

    Source: Journal of Turbomachinery:;2001:;volume( 123 ):;issue: 002:;page 305
    Author(s): Andrew A. McCarter; Graduate Assistant; Xinwen Xiao; Graduate Assistant; Budugur Lakshminarayana; Evan Pugh Professor and Director
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A comprehensive experimental investigation was undertaken to explore the flow field in the tip clearance region of a turbine rotor to understand the physics of tip leakage flow. Specifically ...
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    Predicted Effects of Shunt Injection on the Rotordynamics of Gas Labyrinth Seals 

    Source: Journal of Engineering for Gas Turbines and Power:;2003:;volume( 125 ):;issue: 001:;page 167
    Author(s): N. Kim; Graduate Assistant; S.-Y. Park; Graduate Assistant; D. L. Rhode
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A recent CFD perturbation model for turbomachinery seal rotordynamics was extended for labyrinth shunt injection with an arbitrarily high pressure gas. A large number of measured cases with ...
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    A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads 

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 002:;page 127
    Author(s): Kuo-Ning Chiang; Chang-Ming Liu; Graduate Assistant
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering ...
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    Real-Time Observation of the Evolution of Contact Area Under Boundary Lubrication in Sliding Contact 

    Source: Journal of Tribology:;2002:;volume( 124 ):;issue: 002:;page 229
    Author(s): Sy-Wei Lo; Sheng-Da Tsai; Graduate Assistant
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: To study the evolution of asperity contact in the sliding contact, a new in situ observation system of sheet metal surface is built up. The workpiece is stationary so that the continuous ...
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    Dynamic Modeling and Vibration Control of Electrorheological Mounts 

    Source: Journal of Vibration and Acoustics:;2004:;volume( 126 ):;issue: 004:;page 537
    Author(s): Seung-Bok Choi; Sung-Ryong Hong; Graduate Assistant
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents two different types of electrorheological (ER) mounts that can support a static load of 200 kg. One is a flow mode type, and the other is a squeeze mode type. After ...
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