Abstract: In this technical brief, we describe a simple, yet versatile solder shape prediction model that can handle inclination (as is likely to occur when warped substrates are used) and misalignment ...

Abstract: The goals of the present paper are to apply the recently developed decomposed analysis procedure using a computer code developed in this study. The decomposed technique enables one to determine ...

Abstract: The goals of the present paper are to develop and demonstrate an efficient technique for the design/analysis of electronic packages through a novel decomposition procedure. The ultimate utility ...

Abstract: In this paper, a methodology, and a program based on the methodology, are presented, which, using the reliability of solder joints for various values of design/process parameters, can be estimated ...

Abstract: Understanding the effect of high current density on void formation and growth and relating the size of the void to the resulting electrical/mechanical failure is a critical need at the present ...

Abstract: Performance of a fiberoptic system depends on the coupling efficiency and the alignment retention capability. A fiberoptic system experiences performance degradation due to uncertainties in the ...

Abstract: Our goals in this paper are to develop and demonstrate a computationally efficient methodology for assessing the effect of circuit board warpage, component warpage, and solder volume variation ...

Abstract: Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150–250W per chip for high performance applications. One of the primary obstacles to the ...