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Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present investigation numerically modeled the thermal behavior of the laser diode using the parabolic transient conduction equation. In addition, the current study compared the thermal performance ...
Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical ...
An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental study was conducted to investigate the heat transfer from a parallel flat plate heat sink under a turbulent impinging air jet. A horizontal nozzle plate confined the target ...
Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of ...
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...