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    Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 535
    Author(s): Gamal Refai-Ahmed; Stephanie Trottier
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The present investigation numerically modeled the thermal behavior of the laser diode using the parabolic transient conduction equation. In addition, the current study compared the thermal performance ...
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    Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004:;page 519
    Author(s): Siddharth Bhopte; Gamal Refai-Ahmed; Musa S. Alshuqairi; Dereje Agonafer
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical ...
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    An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 002:;page 166
    Author(s): Eric Sansoucy; Patrick H. Oosthuizen; Gamal Refai-Ahmed
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental study was conducted to investigate the heat transfer from a parallel flat plate heat sink under a turbulent impinging air jet. A horizontal nozzle plate confined the target ...
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    Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001:;page 11009
    Author(s): Banafsheh Barabadi; Gamal Refai-Ahmed; Yogendra K. Joshi; Satish Kumar
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of ...
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    Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture 

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 002:;page 21008
    Author(s): Saket Karajgikar; Kanad Ghose; Cristina Amon; Gamal Refai-Ahmed; Bahgat Sammakia; Dereje Agonafer
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...
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    DSpace software copyright © 2002-2015  DuraSpace
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