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    Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys 

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003:;page 247
    Author(s): G. Z. Wang; K. Becker; J. Wilde; Z. N. Cheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A unified viscoplastic constitutive law, the Anand model, was applied to represent the inelastic deformation behavior for solders used in electronic packaging. The material parameters of the ...
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    Effects of Initial Crack Location on Failure Assessment Curves in Dissimilar Metal Weld Joints in Nuclear Power Plants 

    Source: Journal of Pressure Vessel Technology:;2012:;volume( 134 ):;issue: 006:;page 61405
    Author(s): N. Gong; G. Z. Wang; F. Z. Xuan; S. T. Tu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Based on detailed three-dimensional finite element analyses, accurate, option 3, failure assessment curves (FACs) based on the R6 are constructed for a dissimilar metal weld joint (DMWJ) connecting ...
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