Abstract: The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible ...

Abstract: Development of magnetism based nondestructive testing technology and the Microelectronic mechanical system require accurate computation of perturbed magnetic fields generated by mechanical stress. ...

Abstract: As traditional lead-based solders are banned and replaced by lead-free solders, the drop impact reliability is becoming increasingly crucial because there is little understanding of mechanical ...

Abstract: Behavior of solder joints in microelectronic packages is crucial to the drop impact reliability design of mobile electronic products. In this paper, tensile behaviors of Sn37Pb, Sn3.5Ag, and ...

Abstract: Geometry mismatch in a turbine blade root, which arose in manufacturing process or caused by wearing out during service, leads to contact conditions changed in fir-tree attachments. As a result, ...

Abstract: The cyclic response of steel coupling beams embedded into reinforced concrete boundary elements was studied. Three half‐scale subassemblies representing a portion of a prototype structure were designed, constructed, and ...