Abstract: Failures in electronic packaging under thermal fatigue often result from cracking in solder joints due to creep/fatigue crack growth. A nonlinear, time-dependent finite element analysis was performed ...

Abstract: A solder joint specimen has been designed to determine the stress/strain hysteresis response and fracture behavior of 90 percent wtPb/10 percent wtSn solder alloy. The specimen consists of an ...

Abstract: When modeling the thermomechanical behavior of electronic packages, engineers often need to include the temperature dependence of coefficients of thermal expansion (CTE) of materials involved in ...