Abstract: Large scale three-dimensional finite element analyses of 68 and 44 pin types Quad Flat I-Leaded packages subjected to −55°C to 150°C temperature cycling are performed to predict the ...

Abstract: A new unified visco-plastic constitutive model for the 60 Sn-40 Pb alloy used in solder joints of surface-mount IC packages and semiconductor devices is proposed. The model accounts for the ...

Abstract: This work examines the fracture behavior of ferritic steel welds in the transition temperature regime, where failure can occur either by ductile tearing or cleavage fracture. A computational and ...