Abstract: The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of ...

Abstract: A compact analytical model is proposed for predicting thermal joint resistance of rough polymer-metal interfaces in a vacuum. The model assumes plastic deformation at microcontacts and joint ...

Abstract: An analytical investigation of a novel multilayer insulation concept was conducted using an extended analytical model. This model was developed to accommodate a multilayer screen wire insulation ...

Abstract: Models are presented for the solution of the thermal and mechanical problem of a rigid metallic cylinder indenting an elastic layer with finite thickness which rests on a rigid substrate without ...