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    Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002:;page 145
    Author(s): Q. Guo; E. C. Cutiongco; L. M. Keer; M. E. Fine
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Isothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based ...
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    Isothermal Fatigue of 63Sn-37Pb Solder 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002:;page 110
    Author(s): E. C. Cutiongco; D. A. Jeannotte; S. Vaynman; M. E. Fine
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effects of aging, strain range, hold time at maximum strain and temperature on the isothermal fatigue life of bulk 63Sn-37Pn solder samples over the total strain range (Δ εT ) from 0.3 ...
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    Micromechanical Method to Predict Fatigue Life of Solder 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002:;page 179
    Author(s): A. Zubelewicz; Q. Guo; E. C. Cutiongco; M. E. Fine; L. M. Keer
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fatigue lifetimes of low-tin high-lead and tin-lead eutectic solders under total strain controlled tension-tension tests were studied in this paper. Based on the stress and strain micro-macro ...
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