Abstract: This paper addresses the problem of delamination growth prior to its buckling using mathematical techniques appropriate for mixed boundary value problems. The formulation presented herein does not ...

Abstract: This paper presents an analytical solution to the problem of local buckling induced by delamination of a layered plate. Delamination growth and buckling is an observed failure mode in laminated ...

Abstract: In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global ...

Abstract: An analytical study investigating the local buckling response of a circular delamination along the interface of an elastic layer and a dissimilar substrate with finite thickness is presented. ...

Abstract: A combined complex potential-variational solution method is developed for the analysis of unsymmetrically laminated plates with finite planform geometry, subjected to arbitrary edge loads, and with ...

Abstract: This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property ...