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Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The design of three-dimensional (3D) power delivery network (PDN) is constrained by both power and thermal integrity. Through-silicon via (TSV) as an important part of transmission power and heat in stack, the rational ...
A Novel Five Degree of Freedom Parallel Manipulator and Its Kinematic Optimization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Driven by requirements of fiveaxis numerical control (NC) machine for its executive mechanism, this paper creatively proposes a flow path to synthesize a novel class of ndegreeoffreedom (nDoF, 4 ≤ n ≤ 6) parallel ...