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RISCharacterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Stencil printing is a critical first step in surface mount assembly. However, its robustness can be called into question because of the fact that about 50% or more of the defects found in ...
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power ...