Abstract: Modules attached to circuit cards by peripheral J- and gullwing leads were studied for their behavior under flexure. Three aspects of mechanical behavior were focused upon: the stiffness of the ...

Abstract: As the mechanical, thermal, and electrical demands on 2nd and 3rd level electronic packages increase, so does the need for early dynamic analysis of the proposed design. Estimating effect of ...

Abstract: The primary objective of this paper is to investigate the accuracy of the finite element (FE) smeared properties approach for the determination of the mode shapes and frequencies of a printed ...