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    Creep in Shear of Experimental Solder Joints 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 002:;page 87
    Author(s): D. Tribula; J. W. Morris
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal fatigue failures of solder joints in electronic devices are a great concern in the electronics industry. Since the fatigue load is often in shear the details of thermal fatigue failure ...
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    Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints 

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002:;page 83
    Author(s): D. Tribula; D. Grivas; D. R. Frear; J. W. Morris
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Near-eutectic Pb-Sn solders are widely used for joints in electrical devices. These are liable to failure by thermal fatigue during operation of the device. Since the thermal fatigue load is ...
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