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Creep in Shear of Experimental Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal fatigue failures of solder joints in electronic devices are a great concern in the electronics industry. Since the fatigue load is often in shear the details of thermal fatigue failure ...
Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Near-eutectic Pb-Sn solders are widely used for joints in electrical devices. These are liable to failure by thermal fatigue during operation of the device. Since the thermal fatigue load is ...
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