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Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigates the effect of the anisotropic behavior of the die and the time- and temperature-dependent behavior of epoxy molding compound on the packaging induced stresses for a quad ...
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is ...