Abstract: An analytical model is developed for determining the bowing of a component mounted on a printed wiring board (PWB) that is subjected to a bending moment. The model assumes a uniform elastic ...

Abstract: The rapid advancement of integrated circuits and associated electronic technologies have placed increasing demands on electronic packaging and its material structures in terms of the reliability ...

Abstract: One of the most dominate parameters that influence the calculation of a PWB’s natural frequency is the boundary conditions along the edges of the board. A series of experiments was conducted ...

Abstract: It is a challenge to assess solder joint fatigue life in the modern electronics industry because of complex geometries, complex non-linear viscoplastic material properties, and the frequently ...

Abstract: This paper discusses the assumptions and details of the fatigue life calculations required to predict the fatigue life of quad leaded surface mount components operating in a vibration environment. ...

Abstract: Lead compliance is a critical parameter in optimal design and interconnection reliability of surface mount leaded components. The cyclic force transmitted to the solder joint in surface mount ...

Abstract: This paper discusses the thermo-mechanical fatigue life analysis of an analog Avantek Planarpak™ surface mount device where the entire base of the component is soldered directly to the printed ...