Abstract: Carbon nanotube (CNT)based piezoresistive strain sensors have the potential to outperform traditional siliconbased piezoresistors in MEMS devices due to their high strain sensitivity. However, the resolution of CNTbased ...

Abstract: The desire for thin-film silicon is motivated by the growing needs for flexible electronics, compact packaging, and advanced solar power. In previous work we have presented exfoliation as means to a cost effective way to ...

Abstract: A high electrical and thermal conductivity coupled with low costs make copper (Cu) an enticing alternative to aluminum for the fabrication of interconnects in packaging applications. To tap into the benefits of the ...