Abstract: This paper introduces a novel wafer-edge quality inspection method based on analysis of curved-edge diffractive fringe patterns, which occur when light is incident and diffracts around the wafer edge. The proposed method ...

Abstract: This paper presents a novel nondestructive testing system, magneto-eddy-current sensor (MECS), to enable surface profiling of dissimilar materials by combining magnetic sensing for ferromagnetic materials and eddy-current ...

Abstract: In smart manufacturing, semiconductors play an indispensable role in collecting, processing, and analyzing data, ultimately enabling more agile and productive operations. Given the foundational importance of wafers, the ...