Search
CSV
RISLow Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure ...
40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are ...
Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A fundamental study is carried out to investigate the microstructure and surface treatment possibilities of 304 stainless steel (304SS) substrates. To expose the microstructure, mirror-finished ...
40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Copper–silver (Cu–Ag) composite flip-chip interconnect between silicon (Si) chips and Cu substrates is demonstrated. Array of Cu–Ag columns, each 28 μm in height and 40 μm in diameter, is ...
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold ...